Project | Processing capacity | Process details |
Laminate | CEM-3, FR4 (low/medium/high TG, halogen-free), Rogers, Teflon, Arlon, metal substrate (aluminum substrate, copper substrate) | |
Material brand | KB, Shengyi, NouYa, TUC, Isola, Rogers, Arlon , Taconic, Ventec | Customers qualify the brand |
Number of layers | 1-48 L | |
Maximum board size | 610x1060mm | Dimensional tolerance ± 0.10mm |
Special process | Resin plug hole + hat plating, POFV, Rogers mixed pressure, blind buried hole, back drill, gold finger, bonding IC, blue glue, carbon oil, high temperature resistant glue | |
Board thickness | 0.2-6.0mm | Conventional plate thickness: 0.2/0 4/0.6/0.8/1.0/1.2/1.6/2/2.5mm |
Thickness tolerance | T≥1.0mm, Tol: ±10% T<1.0mm, Tol: ±0.1mm |
Special ± 8% |
Finished inner copper thickness | 1/3-14OZ | |
Finished outer copper thickness | 1/3-12OZ | |
Through-hole single-sided welding ring | 4mil | Via minimum 4mil, plated hole minimum 6mil |
Laser drilling hole size | 0.1mm | |
Hole size tolerance (mechanical drilling) | ± 0.05mm (crimping hole). | The standard tolerance for the finished aperture of mechanical drilling is ± 0.075mm, while the tolerance for crimping holes is ± 0.05mm |
Minimum drill (mechanical drill) | 0.15mm | Recommended design to 0.3mm or above |
Min half-hole size | 0.40mm | The half-hole process is a special process, and the minimum hole size shall not be less than 0.4mm. |
Min. hole size(laser drill) | 0.10mm | |
Aspect ratio | 10:1 | |
Maximum NPTH hole (mechanical drilling) | 6.50mm | |
Minimum line width/line spacing | Min.3/3mils (1ozCu finished) | 4/4Mil (finished copper thickness 1OZ), 5/6Mil (finished copper thickness 2OZ), 8/8Mil (finished copper thickness 3 OZ), it is recommended to increase the line width and spacing |
Solder mask color | Bright green, matte green, black, white, blue, red, yellow | |
Legend Mark height | ≥0.07mm | Minimum Legend Mark height: at 0.07mm |
Legend Mark linewidth | ≥0.1mm | Minimum line width of Legend Mark: 0.1mm |
Surface treatment | ENIG, immersion silver, Immersion tin, HASL (Lead free or not), OSP, gold finger, carbon oil (low resistance/high resistance), hard gold plating |
Immersion gold Au: 1-6μ " Immersion Silver Ag: 0.15μm-0.5μm Tin: 0.8-1.2μm HASL: 1-40μ OSP thickness: 0.20-0 50μm Gold Finger Au: 5-60μ " Hard Gold Plated Au: 5-60μ" |
Bevel edge | Bevel edge angle 20 °, 30 °, 45 ° | |
Carbon ink | Carbon ink resistance value according to customer requirements |
13 years of experience in board making
Tens of thousands of customers worldwide
Exquisite craftsmanship
Timely delivery